Dr. Kuo-Ta Hsieh

Dr. Kuo-Ta Hsieh

Position:Senior: CEM Affiliate

Biography
Dr. Hsieh joined UT-CEM in 2012. His primary research interest has been on parallel multi-physics modeling and simulation such as modeling of high power semiconductor devices, and electromechanical modeling of electromagnetic launching systems.

Prior joining UT-CEM, Dr. Hsieh was an associate director at UT-IAT where he leaded the Material and Computational Analysis Division (MCAD). The focus of the MCAD group is tribology of high-speed electrical contacts, electromagnetic fracture mechanics, electromagnetic effects on conductive fibrous composites, and characterization of material behavior under high strain rate and high heating conditions. The MCAD group has developed a state-of-the-art 3D finite element code, EMAP3D, for solution of coupled electromagnetic-chemical-thermo-mechanical equations and has established and operated a parallel computing facility and Electro-Magnetic Driven Expanding Ring (EMDER) test apparatus. Dr. Hsieh is the author of EMAP3D

Current Projects
* Army Research Lab: Large-scale multi-physics modeling and simulation for electronic and electromechanical Systems
* Boeing: electronics package performance tests under electromagnetic environment

Research Areas/Areas of Interest
* Alternative fuels for vehicles – batteries, ultra capacitors, hydrogen fuel cells, natural gas
* Vehicle and power systems modeling and control
* Hydrogen and natural gas storage and delivery
* Flywheel energy storage
* Advanced composites
* Novel applications for electric machines

About Me
* Avid marathon and ultra-marathon runner

Education
* B.S., Mechanical Engineering, The University of Texas at Austin, 1999
* M.S., Mechanical Engineering, The University of Texas at Austin, 2007

Publications
* S. Satapathy, K. T. Hsieh, “Jump conditions for Maxwell equations and their consequence,” AIP Advances, January 2013.

* J. McDonald, K. T. Hsieh, and S. Satapathy, “Edge Elements and Current Diffusion,” IEEE Transactions on Plasma Science, vol. 39, no. 1, pp. 437-441, January 2011.

* J. McDonald, K. T. Hsieh, and S. Satapathy, “Modeling The 2K! Experiment Using EMAP3D,” 3rd DOD Innovative S&T EMRG WORKSHOP, March 29-31, 2011, Washington, DC.

* J. McDonald, K. T. Hsieh, and S. Satapathy, “Numerical Study of Armature Erosion,” DoD's Classified Workshop on the Applications of Electromagnetic Launch Technology (CWAELT), September 8-10, 2009, Lackland AFB, San Antonio, Texas.

* S. Satapathy, K. T. Hsieh, F. Stefani, and C. Sadlo, “Comparison of Measured In-Bore Magnetic Field with EMAP3D Predictions,” DoD's Classified Workshop on the Applications of Electromagnetic Launch Technology (CWAELT), September 8-10, 2009, Lackland AFB, San Antonio, Texas.

* K. T. Hsieh, S. Satapathy, and M. T. Hsieh, “Effects of Pressure-Dependent Contact Resistivity on Contact Interfacial Conditions,” IEEE Transactions on Magnetics, vol. 45, no. 1, pp. 313-318, January 2009.

* K. T. Hsieh and V. Thiagarajan, “A Novel, Split-Domain Iteration Scheme for Solution of Electromagnetic Diffusion Problems Modeled by the Hybrid Finite Element–Boundary Element Formulation,” IEEE Transactions on Magnetics, vol. 45, no. 1, pp. 587-590, January 2009.

* K. T. Hsieh, C. Lindsey, and S. Satapathy, “Lateral Loads in a Railgun,” DoD Innovative Science & Technology EM Railgun Workshop, September 23-25, 2008, Albuquerque, New Mexico.

* S. Satapathy, T. J. Watt, and K. T. Hsieh, “Subscale Testing of a Novel Rail Geometry,” Classified Seminar on Applications of Electromagnetic Launch Technology (CEML), May 2-4, 2007, Washington, DC.

* S. Satapathy and K. T. Hsieh, “A Novel Railgun Geometry Concept,” Classified Seminar on Applications of Electromagnetic Launch Technology (CEML), May 2-4, 2007, Washington, DC.

* K. T. Hsieh, “Numerical Study on Groove Formation of Rails for Various Materials,” IEEE Transaction on Magnetics, vol. 41, pp. 380-385, January 2005.

* V.T. Thiagarajan and K. T. Hsieh, "Investigation of a 3-D Hybrid Finite-Element / Boundary- Element Method for Electromagnetic Launch Applications and Validation Using Semi-analytical Solution," IEEE Transactions on Magnetics, vol. 41, pp. 398-403, January 2005.

* K. T. Hsieh and S. Satapathy, "Plasticity Model in EMAP3D," IEEE Transactions on Magnetics, vol. 39, pp. 142-147, January 2003.

* B. Kim, K. T. Hsieh, and F. X. Bostick, “Numerical Study of Electromagnetic Diffusion Effect Due to Imperfect Electrical Contact,” Proceedings of the 7th Joint Magnetism and Magnetic Materials (MMM)-Intermag Conference.

* B. Kim, K. T. Hsieh, and F. Bostick, “A Three-Dimensional Finite Element Model for Thermal Effect of Imperfect Electric Contacts,” IEEE Transactions on Magnetics, vol.35, pp.170-174, 1999

* K. T. Hsieh and B.K. Kim, “3D Modeling of Sliding Electrical Contact,” IEEE Transactions on Magnetics, vol. 33, No. 1, pp.237-239, 1997.

* K. T. Hsieh, “A Lagrangian Formulation for Mechanically, Thermally Coupled Electromagnetic Diffusive Processes with Moving Conductors,” IEEE Trans on Magnetics, vol. 31, No. 1, pp. 604-609, 1995.